Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
Also Known As:
SKU919923665
Published by
International Electrotechnical Commission
IEC
Publication Date2004-07-15
Pages CountPages62
This part of IEC 60068 outlines test Td, applicable to surface mounting devices (SMD), which are intended to mount on substrates. This standard provides the standard procedures for solder alloys containing lead (Pb) and for lead-free solder alloys. This standard provides standard procedures for determining the solderability and resistance of soldering heat to lead-free solder alloys. This standard provides standard procedures for determining the solderability, dissolution of metallization and resistance of soldering heat to solder alloys which are eutectic or near eutectic tin lead solders.
Details
History and complementary documents
History
| Edition | 3.0 |
| ICS Codes | 19.040 - Environmental testing 31.190 - Electronic component assemblies |
| Language(s) | English + French |
| File Size | 1.4 MB |
Purchase
Right after completing the purchase process, you will immediately get a digital copy of this standard which is:
Not Locked
Printable
Multi-User
$
58.00
